Por favor, use este identificador para citar o enlazar este ítem: https://hdl.handle.net/11000/34214

Low-Cost Direct-Writing of Silver-Based Ink for Planar Microwave Circuits up to 10 GHz

Título :
Low-Cost Direct-Writing of Silver-Based Ink for Planar Microwave Circuits up to 10 GHz
Autor :
Blanco Angulo, Carolina  
Martínez Lozano, Andrea  
Arias, Julia  
Rodríguez-Martínez, Alberto
Vicente Samper, Jose Maria  
Sabater-Navarro, Jose Maria  
Editor :
Institute of Electrical and Electronics Engineers
Departamento:
Departamentos de la UMH::Ingeniería de Comunicaciones
Fecha de publicación:
2023-01-06
URI :
https://hdl.handle.net/11000/34214
Resumen :
Direct ink writing (DIW) of conductive ink is a printed electronics technology that allows a variety of electronic circuits to be produced in a simple way and with minimal waste of materials. In recent years it has been used for rapid prototyping of RF circuits typically working at S-band frequencies (2–4 GHz). In an attempt to extend this frequency range while maintaining cost-effective prototyping, this work has focused on proving the feasibility of DIW of silver-conductive (SC) ink for the fabrication of planar microwave circuits beyond 10 GHz, more specifically, ultra-wideband (UWB) antennas for medical applications. For this purpose, the DC and RF performance of the SC ink, as well as the FR4 substrate used, were first evaluated. Based on the comparison between experimental and simulated results, we have found that the effective RF conductivity of the SC ink is approximately 27.6% of its DC value and 3.4% of the copper conductivity. A few test microstrip circuits were fabricated by DIW, namely two S-band filters and one UWB antenna. The overall measured performance of all of them agreed well with simulations. In particular, the DIW antenna exhibited a bandwidth of 8.2 GHz (between 2.4 and 10.6 GHz), and was compared with an identical copper antenna showing that both have very similar characteristics. It was also found that the lower conductivity of SC ink as compared to copper led to a gain reduction of only 0.3 dB.
Palabras clave/Materias:
Direct-ink-writing
silver-conductive ink
additive manufacturing
printed electronics
ultrawideband antennas
electrical conductivity
conductor losses
ultrasonic non-destructive testing
Área de conocimiento :
CDU: Ciencias aplicadas: Ingeniería. Tecnología
Tipo de documento :
info:eu-repo/semantics/article
Derechos de acceso:
info:eu-repo/semantics/openAccess
Attribution-NonCommercial-NoDerivatives 4.0 Internacional
DOI :
https://10.1109/ACCESS.2023.3234772
Aparece en las colecciones:
Artículos Ingeniería Comunicaciones



Creative Commons La licencia se describe como: Atribución-NonComercial-NoDerivada 4.0 Internacional.