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dc.contributor.authorBlanco Angulo, Carolina-
dc.contributor.authorMartínez Lozano, Andrea-
dc.contributor.authorArias, Julia-
dc.contributor.authorRodríguez-Martínez, Alberto-
dc.contributor.authorVicente Samper, Jose Maria-
dc.contributor.authorSabater-Navarro, Jose Maria-
dc.contributor.otherDepartamentos de la UMH::Ingeniería de Comunicacioneses_ES
dc.date.accessioned2025-01-08T09:43:17Z-
dc.date.available2025-01-08T09:43:17Z-
dc.date.created2023-01-06-
dc.identifier.citationIEEE Acces, VOLUME 11, 2023es_ES
dc.identifier.issn2169-3536-
dc.identifier.urihttps://hdl.handle.net/11000/34214-
dc.description.abstractDirect ink writing (DIW) of conductive ink is a printed electronics technology that allows a variety of electronic circuits to be produced in a simple way and with minimal waste of materials. In recent years it has been used for rapid prototyping of RF circuits typically working at S-band frequencies (2–4 GHz). In an attempt to extend this frequency range while maintaining cost-effective prototyping, this work has focused on proving the feasibility of DIW of silver-conductive (SC) ink for the fabrication of planar microwave circuits beyond 10 GHz, more specifically, ultra-wideband (UWB) antennas for medical applications. For this purpose, the DC and RF performance of the SC ink, as well as the FR4 substrate used, were first evaluated. Based on the comparison between experimental and simulated results, we have found that the effective RF conductivity of the SC ink is approximately 27.6% of its DC value and 3.4% of the copper conductivity. A few test microstrip circuits were fabricated by DIW, namely two S-band filters and one UWB antenna. The overall measured performance of all of them agreed well with simulations. In particular, the DIW antenna exhibited a bandwidth of 8.2 GHz (between 2.4 and 10.6 GHz), and was compared with an identical copper antenna showing that both have very similar characteristics. It was also found that the lower conductivity of SC ink as compared to copper led to a gain reduction of only 0.3 dB.es_ES
dc.formatapplication/pdfes_ES
dc.format.extent13es_ES
dc.language.isoenges_ES
dc.publisherInstitute of Electrical and Electronics Engineerses_ES
dc.rightsinfo:eu-repo/semantics/openAccesses_ES
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 Internacional*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectDirect-ink-writinges_ES
dc.subjectsilver-conductive inkes_ES
dc.subjectadditive manufacturinges_ES
dc.subjectprinted electronicses_ES
dc.subjectultrawideband antennases_ES
dc.subjectelectrical conductivityes_ES
dc.subjectconductor losseses_ES
dc.subjectultrasonic non-destructive testinges_ES
dc.subject.otherCDU::6 - Ciencias aplicadas::62 - Ingeniería. Tecnologíaes_ES
dc.titleLow-Cost Direct-Writing of Silver-Based Ink for Planar Microwave Circuits up to 10 GHzes_ES
dc.typeinfo:eu-repo/semantics/articlees_ES
dc.relation.publisherversionhttps://10.1109/ACCESS.2023.3234772es_ES
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