Please use this identifier to cite or link to this item: https://hdl.handle.net/11000/30646
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dc.contributor.authorGarcía Martínez, Héctor-
dc.contributor.authorÁvila Navarro, Ernesto-
dc.contributor.authorTorregrosa-Penalva, Germán-
dc.contributor.authorRodríguez-Martínez, Alberto-
dc.contributor.authorBlanco Angulo, Carolina-
dc.contributor.authorde la Casa Lillo, Miguel Ángel-
dc.contributor.otherDepartamentos de la UMH::Ingeniería de Comunicacioneses_ES
dc.date.accessioned2024-01-26T08:48:50Z-
dc.date.available2024-01-26T08:48:50Z-
dc.date.created2020-08-27-
dc.identifier.citationPolymers 2020, 12, 1946es_ES
dc.identifier.issn2073-4360-
dc.identifier.urihttps://hdl.handle.net/11000/30646-
dc.description.abstractThis work presents a study on the implementation and manufacturing of low-cost microwave electronic circuits, made with additive manufacturing techniques using fused deposition modeling (FDM) technology. First, the manufacturing process of substrates with different filaments, using various options offered by additive techniques in the manufacture of 3D printing parts, is described. The implemented substrates are structurally analyzed by ultrasound techniques to verify the correct metallization and fabrication of the substrate, and the characterization of the electrical properties in the microwave frequency range of each filament is performed. Finally, standard and novel microwave filters in microstrip and stripline technology are implemented, making use of the possibilities offered by additive techniques in the manufacturing process. The designed devices were manufactured and measured with good results, which demonstrates the possibility of using low-cost 3D printers in the design process of planar microwave circuits.es_ES
dc.formatapplication/pdfes_ES
dc.format.extent18es_ES
dc.language.isoenges_ES
dc.publisherMDPIes_ES
dc.rightsinfo:eu-repo/semantics/openAccesses_ES
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 Internacional*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjecthigh-frequency circuitses_ES
dc.subjectmaterial characterization high-frequencyes_ES
dc.subjectrapid prototypinges_ES
dc.subjectultrasonic characterizationes_ES
dc.subject3D printinges_ES
dc.subject.classificationTeoría de la Señal y Comunicacioneses_ES
dc.subject.otherCDU::6 - Ciencias aplicadas::62 - Ingeniería. Tecnologíaes_ES
dc.titleLow-Cost Additive Manufacturing Techniques Applied to the Design of Planar Microwave Circuits by Fused Deposition Modelinges_ES
dc.typeinfo:eu-repo/semantics/articlees_ES
dc.relation.publisherversionHTTP://doi.org/10.3390/polym12091946es_ES
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Artículos Ingeniería Comunicaciones


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