Please use this identifier to cite or link to this item:
https://hdl.handle.net/11000/30646
Low-Cost Additive Manufacturing Techniques Applied to the Design of Planar Microwave Circuits by Fused Deposition Modeling
Title: Low-Cost Additive Manufacturing Techniques Applied to the Design of Planar Microwave Circuits by Fused Deposition Modeling |
Authors: García Martínez, Héctor Ávila Navarro, Ernesto Torregrosa-Penalva, Germán Rodríguez-Martínez, Alberto Blanco Angulo, Carolina de la Casa Lillo, Miguel Ángel |
Editor: MDPI |
Department: Departamentos de la UMH::Ingeniería de Comunicaciones |
Issue Date: 2020-08-27 |
URI: https://hdl.handle.net/11000/30646 |
Abstract:
This work presents a study on the implementation and manufacturing of low-cost
microwave electronic circuits, made with additive manufacturing techniques using fused deposition
modeling (FDM) technology. First, the manufacturing process of substrates with different filaments,
using various options offered by additive techniques in the manufacture of 3D printing parts,
is described. The implemented substrates are structurally analyzed by ultrasound techniques to verify
the correct metallization and fabrication of the substrate, and the characterization of the electrical
properties in the microwave frequency range of each filament is performed. Finally, standard and
novel microwave filters in microstrip and stripline technology are implemented, making use of the
possibilities offered by additive techniques in the manufacturing process. The designed devices were
manufactured and measured with good results, which demonstrates the possibility of using low-cost
3D printers in the design process of planar microwave circuits.
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Keywords/Subjects: high-frequency circuits material characterization high-frequency rapid prototyping ultrasonic characterization 3D printing |
Knowledge area: CDU: Ciencias aplicadas: Ingeniería. Tecnología |
Type of document: application/pdf |
Access rights: info:eu-repo/semantics/openAccess Attribution-NonCommercial-NoDerivatives 4.0 Internacional |
DOI: HTTP://doi.org/10.3390/polym12091946 |
Appears in Collections: Artículos Ingeniería Comunicaciones
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