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Low-Cost Additive Manufacturing Techniques Applied to the Design of Planar Microwave Circuits by Fused Deposition Modeling


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Título :
Low-Cost Additive Manufacturing Techniques Applied to the Design of Planar Microwave Circuits by Fused Deposition Modeling
Autor :
García Martínez, Héctor  
Ávila Navarro, Ernesto  
Torregrosa-Penalva, Germán  
Rodríguez-Martínez, Alberto
Blanco Angulo, Carolina
de la Casa Lillo, Miguel Ángel  
Editor :
MDPI
Departamento:
Departamentos de la UMH::Ingeniería de Comunicaciones
Fecha de publicación:
2020-08-27
URI :
https://hdl.handle.net/11000/30646
Resumen :
This work presents a study on the implementation and manufacturing of low-cost microwave electronic circuits, made with additive manufacturing techniques using fused deposition modeling (FDM) technology. First, the manufacturing process of substrates with different filaments, using various options offered by additive techniques in the manufacture of 3D printing parts, is described. The implemented substrates are structurally analyzed by ultrasound techniques to verify the correct metallization and fabrication of the substrate, and the characterization of the electrical properties in the microwave frequency range of each filament is performed. Finally, standard and novel microwave filters in microstrip and stripline technology are implemented, making use of the possibilities offered by additive techniques in the manufacturing process. The designed devices were manufactured and measured with good results, which demonstrates the possibility of using low-cost 3D printers in the design process of planar microwave circuits.
Palabras clave/Materias:
high-frequency circuits
material characterization high-frequency
rapid prototyping
ultrasonic characterization
3D printing
Área de conocimiento :
CDU: Ciencias aplicadas: Ingeniería. Tecnología
Tipo documento :
application/pdf
Derechos de acceso:
info:eu-repo/semantics/openAccess
Attribution-NonCommercial-NoDerivatives 4.0 Internacional
DOI :
HTTP://doi.org/10.3390/polym12091946
Aparece en las colecciones:
Artículos Ingeniería Comunicaciones



Creative Commons La licencia se describe como: Atribución-NonComercial-NoDerivada 4.0 Internacional.