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System-on-Chip for Real-Time Satellite Photovoltaic Curves Telemetry


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Title:
System-on-Chip for Real-Time Satellite Photovoltaic Curves Telemetry
Authors:
Gutiérrez Mazón, roberto  
Blanes, Jose M.  
Marroquí, David  
Garrigós, Ausias  
Toledo Melero, Fco. Javier  
Editor:
Instituto de Ingenieros Eléctricos y Electrónicos
Department:
Departamentos de la UMH::Ingeniería de Comunicaciones
Issue Date:
2018-03
URI:
https://hdl.handle.net/11000/30635
Abstract:
This paper presents a System-on-Chip design for real-time satellites photovoltaic curves telemetry. In these applications, the limitation of memory and communication bandwidth makes quite difficult to store and to transmit the whole characteristic current-voltage (I–V) curve of any solar section in real-time. The proposed solution is based on the real-time calculation of the equivalent singlediode model of the solar section. The single-diode model fits accurately the behavior of any solar panel, so once the parameters are calculated, saved, and transmitted, at any working conditions, that specific curve could be later reproduced. The system is based on a LEON3 32-bit microprocessor core implemented in a Field Programmable Gate Array. The LEON microprocessors were originally designed by the European Space Agency, Paris, France, to be used in space projects where high reliability is required. In addition, in order to design the system as simple and reliable as possible, from all the methods available in the literature to extract the five parameters of the equivalent model, the Oblique Asymptote Method has been chosen for its simplicity and precision. Finally, some experimental results are presented to demonstrate the accuracy of the final system.
Keywords/Subjects:
LEON microprocessor
oblique asymptote (OA) method
photovoltaic energy
single-diode model
system-on-chip
Knowledge area:
CDU: Ciencias aplicadas: Ingeniería. Tecnología
Type of document:
application/pdf
Access rights:
info:eu-repo/semantics/closedAccess
Attribution-NonCommercial-NoDerivatives 4.0 Internacional
DOI:
https://doi.org/10.1109/TII.2017.2755463
Appears in Collections:
Artículos Ingeniería Comunicaciones



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